HSF PCCOOLER S83 V2 TDP 90W

Bracket Cooler Fan Heatsink For AMD Isi : 1 set bracket dan 4 buah baut

HSF PCCooler GI-D56V RGB Spesifikasi: Intel LGA2066/2011/1366/1150/1151/1155/1156/775 AMD FM2+/FM2/FM1/AM4/AM3+/AM3/AM2+/AM2 TDP 160W Dimension 126(L)X85(W)X148(H)mm Weight 720g(with fan) Material 5X6mm Copper powder heat pipes 3*U type + 2*L type FAN SPECIFICATION Dimension 120×120×25mm Speed 1000-2000RPM(PWM), 72CFM Noise 8-29.1dB(A) Bearing Type Hydraulic Bearing Power Input 10.8-13.2VDC, 0.4A, 4.7W

Heatsink Fan Intel LGA775 & 115X OEM mirip bawaan original processor

COMPABILITY: Untuk platform Intel: LGA 1150/1151/1155/1156/1200/1700 Untuk platform AMD: AM4/AM3 +/AM3/AM2 +/AM2/FM2 +/FM2/FM1 Jenis bantalan: bantalan hidrolik Kecepatan Kipas: 900-2300RPM (± 10%) Volume udara: 15-36CFM Kebisingan: 20-30.5dBA Tegangan Input: DC 12V Antarmuka kipas: 3 pin Efek pencahayaan: pencahayaan otomatis, tidak dapat disesuaikan Bahan: tembaga aluminium Aloi + ABS

Heatsink Prosesor Intel LGA115X series Bisa dipakai di motherboard LGA1155, 1150 dan LGA1151

HSF Cooler Master Hyper H410R Product Name Hyper H410R Product Number RR-H410-20PK-R1 CPU socket* Intel LGA 1151/1150/1155/1156/775 AMD AM4 / AM3+ / AM3 / AM2+ /AM2 / FM2+ / FM2 / FM1 Dimensions 84.5X102X136.5 mm(3.3×4.0×5.3inch) Heat Sink Material 4 Direct Contact Heat pipes / Aluminum Fins Heat Sink weight 348g(0.76lb) Heat Pipe Dimensions Φ6mm Fan… selengkapnya

Cek stock terlebih dahulu sebelum order (Ketersediaan Terbatas) ID-COOLING SE-224-XTS Specification : Compatibility Intel LGA1700/1200/1151/1150/1155/1156 AMD AM5/AM4 TDP 220W Overall Dimension 120×75×151mm (L×W×H) Heatsink Material 4×Ф6mm Heatpipe(Direct Touch)+Aluminum Fin Weight 650g (heatsink+fan) Fan Dimension 120×120×25mm Fan Speed 600±200~1500±10%RPM Max. Air Flow 70CFM Max. Static Pressure 2.15mmH2O Noise 28.9dB(A) Max. Rated Voltage 12VDC (4pin PWM) Operating… selengkapnya

M. 2-3 radiator All aluminum + anode sandblasting can not only improve the overall appearance of the machine, but also better fit with 450 inclined wind guide structure to take away the SSD heat as soon as possible. The Mini size brings better compatibility. All aluminum deflector radiatorEquipped with high quality thermal conductivity silica gel… selengkapnya

Fitur: Equipped with multiple clips to support Intel LGA1155/1156/775 and AMD AM3/AM2+/AM2/K8. 2 sintered powder heatpipes directly touch the CPU surface and conduct heat from the processor quickly to protect it from overheating. Well built aluminum heatsink dissipates heat efficiently. TPE Fan Cover helps absorb operating vibration and reduce fan noise. Spesifikasi:   Overall Dimension… selengkapnya

CPU Intel LGA 775/ 1155/ 1156 / 1366 / 2011 (Core i3 / i5 / i7 CPU) AMD AM4/ FM2/ FM1 / AM3+ / AM3/ AM2+ / AM2 TOTAL DIMENSIONS (W x D x H) 127 x 75 x 158mm HEAT SINK MATERIAL ALUMINIUM FINS(4HEAT PIPES) HEAT PIPE DIMENSIONS 6mm TDP(Thermal Design Power) 150W FAN… selengkapnya